Abstract: This study aims to demonstrate the applicability of a new temporary bonding film and a photonic de-bonding method for ultra-thin wafer handling process. We conducted wafer thinning supported ...
Learn how frameworks like Solid, Svelte, and Angular are using the Signals pattern to deliver reactive state without the ...
Abstract: In this article, a machine-learning-assisted antenna array isolation optimization method for bistatic in-band full-duplex (IBFD) communication systems based on a novel intelligent surface ...
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